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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12753480 B1

PDFFull Text
Date of Patent:
Oct. 06, 2026

Filed:

Mar. 23, 2022

Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus

Applicant:

Toto Ltd., Kitakyushu, JP;

Inventors:

Ryunosuke Nakagawa, Kitakyushu, JP;

Tatsuya Koga, Kitakyushu, JP;

Assignee:

Toto Ltd., Kitakyushu, JP;

Attorneys:

Carrier, Shende & Associates P.C.

Fulchand P. Shende

Joseph P. Carrier

Primary Examiner:

Keath T Chen

Int. Cl.
CPC ...
C23C 4/06 (2016.01); C23C 4/11 (2016.01); C23C 4/12 (2016.01); H01J 37/32 (2006.01); H10P 14/60 (2026.01);
U.S. Cl.
CPC ...
C23C 4/06 (2013.01); C23C 4/11 (2016.01); C23C 4/12 (2013.01); H01J 37/32495 (2013.01); H10P 14/6336 (2026.01); H01J 2237/332 (2013.01);
Abstract

According to one embodiment, a semiconductor manufacturing apparatus member is used inside a chamber of a semiconductor manufacturing apparatus. The member includes a base material and a ceramic layer located on the base material. The base material includes a first surface, a second surface, and at least one hole extending through the first and second surfaces. The at least one hole includes a first, a second and a third hole part. The first hole part is continuous with the first surface and is oblique. The second hole part is between the second surface and the first hole part. The third hole part is between the first hole part and the second hole part and is oblique. The ceramic layer includes a first part located on the first surface and a second part located on the first hole part.

Find Patent Forward Citations

Nakagawa, Ryunosuke. (2026). Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus (U.S. Patent No. 12753480). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12753480

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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