The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Sep. 09, 2021
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Rihoko Watanabe, Osaka, JP;
Hirosuke Saito, Osaka, JP;
Hiroaki Umehara, Fukushima, JP;
Hiroharu Inoue, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 53/00 (2006.01); C08J 5/24 (2006.01); C08J 7/04 (2020.01); C08K 3/36 (2006.01); C08K 5/3415 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 53/00 (2013.01); C08J 5/246 (2021.05); C08J 7/0427 (2020.01); C08K 3/36 (2013.01); C08K 5/3415 (2013.01); H05K 1/0353 (2013.01); C08J 2325/06 (2013.01); C08L 2203/16 (2013.01);
Abstract
A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.
Quick Actions:
Watanabe, Rihoko. (2026). Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board (U.S. Patent No. 12753301). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12753301
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile