The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
May. 16, 2022
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Hirosuke Saito, Osaka, JP;
Yasunori Nishiguchi, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 212/34 (2006.01); C08F 222/40 (2006.01); C08J 5/24 (2006.01); C08K 3/013 (2018.01); C08K 5/49 (2006.01);
U.S. Cl.
CPC ...
C08F 212/34 (2013.01); C08F 222/40 (2013.01); C08J 5/24 (2013.01); C08K 3/013 (2018.01); C08K 5/49 (2013.01);
Abstract
An aspect of the present invention relates to a resin composition containing a maleimide compound (A) having an indane structure in the molecule and a hydrocarbon-based compound (B) represented by the following Formula (1). In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group and an aliphatic cyclic group. n represents an integer from 1 to 10.
Saito, Hirosuke. (2026). Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board (U.S. Patent No. 12753254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12753254
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile