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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12752524 B1

PDFFull Text
Date of Patent:
Oct. 06, 2026

Filed:

Jun. 20, 2023

Manufacturing a conductive transfer

Applicant:

Conductive Transfers Limited, Barnsley, GB;

Inventors:

Paul Timothy Brook, Barnsley, GB;

Mark John Catchpole, Saxmundham, GB;

Steven Paul Sutcliffe, Rotherham, GB;

Assignee:

INTERLINK ELECTRONICS, INC., Fremont, CA (US);

Attorney:

Maschoff Brennan

Primary Examiner:

Ian A Rummel

Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/412 (2013.01); B32B 2457/00 (2013.01);
Abstract

A method of manufacturing a conductive transfer, comprises the step of printing a non-conductive ink onto a release film to produce a first non-conductive ink layer and curing the first non-conductive ink layer. The method comprises printing an electrically conductive ink onto the first non-conductive ink layer to produce an electrically conductive ink layer and curing the electrically conductive ink layer; and printing a non-conductive ink over the electrically conductive layer to produce a second non-conductive ink layer and curing the second non-conductive ink layer. An adhesive material is printed over the second non-conductive ink layer to produce an adhesive layer and the adhesive layer is cured. The release film comprising the first non-conductive ink layer, electrically conductive ink layer, second non-conductive ink layer and adhesive layer is applied to a first substrate and at least one of heat or pressure is applied to the first substrate and release film such that the adhesive layer adheres to said first substrate. The first substrate comprises a thermoplastic polymer.

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Brook, Paul. (2026). Manufacturing a conductive transfer (U.S. Patent No. 12752524). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12752524

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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