The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Feb. 27, 2025
Applicants:

Cubicure Gmbh, Vienna, AT;

Align Technology, Inc., San Jose, CA (US);

Inventors:

Thomas Förster-Romswinckel, Pixendorf, AT;

Robert Gmeiner, Vienna, AT;

Otmar Martl, Linz, AT;

Oliver Kesel, Pixendorf, AT;

Bernhard Busetti, Vienna, AT;

Markus Kury, Vienna, AT;

Michael Christopher Cole, San Jose, CA (US);

Peter Dorfinger, Woodside, CA (US);

Shawn Stromenger, Milpitas, CA (US);

Viswanath Meenakshisundaram, Santa Clara, CA (US);

Lance Robert Pickens, Campbell, CA (US);

Mario Pavic, Vienna, AT;

Kaimir Bekavac, Felixdorf, AT;

Assignee:

Align Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/245 (2017.01); B22F 12/30 (2021.01); B22F 12/33 (2021.01); B29C 64/124 (2017.01); B29C 64/171 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B29C 64/295 (2017.01); B29C 64/35 (2017.01);
U.S. Cl.
CPC ...
B29C 64/245 (2017.08); B22F 12/30 (2021.01); B22F 12/33 (2021.01); B29C 64/124 (2017.08); B29C 64/171 (2017.08); B33Y 30/00 (2014.12); B29C 64/295 (2017.08); B29C 64/35 (2017.08); B33Y 10/00 (2014.12);
Abstract

Systems, methods, and devices for additive manufacturing are provided. In some embodiments, an assembly for supporting 3D objects during an additive manufacturing process is provided. The assembly can include a plurality of build platforms, each build platform configured to support one or more 3D objects during the additive manufacturing process. The assembly can also include a carrier configured to support the plurality of build platforms. The assembly can further include an attachment mechanism configured to releasably couple the plurality of build platforms to the carrier during the additive manufacturing process such that the plurality of build platforms collectively form a build plane having a vertical deviation no greater than 500 μm.


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