The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Apr. 18, 2023
Seiko Epson Corporation, Tokyo, JP;
Tatsuya Tsuboi, Okaya, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A mold manufacturing method used in an injection molding apparatus has a first step of shaping a laminated body that becomes a part of the mold by discharging molding material and stacking layers on a base plate having a first member with a first opening and a second member assembled into the first opening, a second step of removing the second member from the base plate on which at least a part of the laminated body has been shaped, and performing at least one of a cutting process and an insertion of a nesting member on the laminated body, which is at least partially shaped, and a third step, performed after the second step, of assembling the base plate with the laminated body is shaped, or a base plate with the laminated body is shaped and all the second members are removed, into the second opening in a mold base.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile