The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Mar. 06, 2024
Moriroku Technology Company, Ltd., Tokyo, JP;
Tatsuki Sugasawa, Tokyo, JP;
MORIROKU CO., LTD., Tokyo, JP;
Abstract
The present invention relates to a foil stamping die used for foil stamping, and a method of manufacturing a vehicle interior component using the foil stamping die. An object of the present invention is to provide a foil stamping technique capable of enhancing the design property of a printing object. In a foil stamping die capable of transferring a foil to the printing object while applying an uneven pattern to a surface of the printing object by pressing the die toward the printing object on which the foil is placed, a pattern-shape portion which is a portion corresponding to the uneven pattern is provided, and an edge of the pattern-shape portion has the same thickness over the entire area thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile