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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12751631 B1

PDFFull Text
Date of Patent:
Oct. 06, 2026

Filed:

Mar. 18, 2024

Photoacoustic sensor using micromachined ultrasonic transducers

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Bernard Herrera Soukup, Sunnyvale, CA (US);

Hrishikesh Vijaykumar Panchawagh, Cupertino, CA (US);

Sumit Agrawal, Sunnyvale, CA (US);

Nicholas Buchan, San Jose, CA (US);

John Keith Schneider, Williamsville, NY (US);

Kostadin Dimitrov Djordjev, Los Gatos, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

QUALCOMM Incorporated

Primary Examiner:

Andrew W Begeman

Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 8/00 (2006.01); A61B 8/08 (2006.01); H10N 30/85 (2023.01); H10N 30/88 (2023.01);
U.S. Cl.
CPC ...
A61B 5/0095 (2013.01); A61B 5/0037 (2013.01); A61B 8/0891 (2013.01); A61B 8/4477 (2013.01); A61B 8/4494 (2013.01); H10N 30/852 (2023.02); H10N 30/883 (2023.02);
Abstract

Some disclosed examples pertain to a photoacoustic apparatus that can include a substrate such as a semiconductor substrate, a light source system that includes one or more light-emitting elements on the substrate, and an ultrasonic receiver system that includes an array of micromachined ultrasonic transducer elements on the substrate. The ultrasonic receiver system is configured to detect acoustic waves corresponding to a photoacoustic response of a target object to light provided by the light source system. In some implementations, the photoacoustic apparatus includes an encapsulation layer disposed over the light source system and the ultrasonic receiver system.

Find Patent Forward Citations

Herrera Soukup, Bernard. (2026). Photoacoustic sensor using micromachined ultrasonic transducers (U.S. Patent No. 12751631). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751631

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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