The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Nov. 02, 2023
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Koji Saito, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10D 86/85 (2025.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10D 86/85 (2025.01); H10W 90/811 (2026.01); H10W 72/5522 (2026.01); H10W 72/5524 (2026.01); H10W 72/5525 (2026.01); H10W 72/884 (2026.01); H10W 72/932 (2026.01); H10W 72/9415 (2026.01); H10W 72/9445 (2026.01); H10W 90/736 (2026.01); H10W 90/753 (2026.01);
Abstract

A signal transmission device provided with an insulated chip. The insulated chip includes: an element insulating layer; and a first insulated element and a second insulated element which are provided in the element insulating layer. The first insulated element includes a first front-surface-side electrically conductive portion and a first back-surface-side electrically conductive portion. The second insulated element includes a second front-surface-side electrically conductive portion and a second back-surface-side electrically conductive portion. The first back-surface-side electrically conductive portion and the second back-surface-side electrically conductive portion are electrically connected to each other. The first front-surface-side electrically conductive portion is electrically connected to a primary-side circuit via the first pad. The second front-surface-side electrically conductive portion is electrically connected to a secondary-side circuit via the second pad.


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