The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Jan. 04, 2024
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Isamu Nishimura, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/611 (2026.01); H10W 70/65 (2026.01); H10W 72/07554 (2026.01); H10W 72/5445 (2026.01); H10W 72/5449 (2026.01); H10W 72/547 (2026.01); H10W 72/5522 (2026.01); H10W 72/5524 (2026.01); H10W 72/5525 (2026.01); H10W 72/944 (2026.01); H10W 72/952 (2026.01); H10W 90/753 (2026.01); H10W 90/754 (2026.01); H10W 90/794 (2026.01);
Abstract

A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element including a first coil; a second coil magnetically coupled to the first coil; and a support substrate on which the first semiconductor element and the second semiconductor element are mounted. The support substrate includes an insulating base member, and a substrate wiring formed on the base member. The substrate wiring includes a first wiring member electrically interposed between the first semiconductor element and the first coil, and a second wiring member electrically interposed between the second semiconductor element and the second coil. The second coil is arranged between the first coil and the base member. The insulating element is supported by the support substrate.


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