The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jul. 21, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Disclosed is a semiconductor package including a substrate, a first semiconductor chip on the substrate and including a through via in the first semiconductor chip and a plurality of first bonding pads on an upper portion of the first semiconductor chip, a second semiconductor chip on the first semiconductor chip and including a plurality of second bonding pads on a lower portion of the second semiconductor chip, and a conductive post between a top surface of the substrate and a bottom surface of the second semiconductor chip and laterally spaced apart from the first semiconductor chip. The first bonding pads are in contact with the second bonding pads. A width in a first direction parallel to a plane defined by a bottom surface of the substrate of the second semiconductor chip is greater than a width in the first direction of the first semiconductor chip.