The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Mar. 27, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Injae Lee, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a package substrate extending in a first direction, the package substrate having at least one first opening in a chip mounting region of the package substrate; a first semiconductor chip mounted in the chip mounting region on an upper surface of the package substrate; a plurality of second semiconductor chips sequentially stacked on the upper surface of the package substrate and spaced apart from the first semiconductor chip in the first direction; a sealant covering the first semiconductor chip and the plurality of second semiconductor chips on the package substrate, the sealant filling a gap between the first semiconductor chip and the package substrate and filling an interior of the at least one first opening of the package substrate; and a taping film attached on a lower surface of the package substrate to cover at least a portion of the sealant exposed in the first opening.