The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Dec. 14, 2021
The University of Hong Kong, Hong Kong, HK;
Mingxin Huang, Hong Kong, HK;
Shien Ping Feng, Hong Kong, HK;
THE UNIVERSITY OF HONG KONG, Hong Kong, CN;
Abstract
Disclosed is a method of bonding two copper structures involving compressing a first copper structure with a second copper structure under a stress from 0.1 MPa to 50 MPa and under a temperature of 250° C. or less so that a bonding surface of the first copper structure is bonded to the bonding surface of the second copper structure. At least one of the bonding surface of the first copper structure and the bonding surface of the second copper structure have a layer of nanograins of copper having an average grain size of 5 nm to 500 nm. The layer of the nanograins of copper having a thickness of 10 nm to 10 μm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile