The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jul. 25, 2023
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Afshin Dadvand, Durham, NC (US);
Devarajan Balaraman, Apex, NC (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/68 (2026.01); H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/68 (2026.01); H10W 70/417 (2026.01); H10W 72/01938 (2026.01); H10W 72/073 (2026.01); H10W 72/07331 (2026.01); H10W 72/352 (2026.01); H10W 72/381 (2026.01); H10W 72/884 (2026.01); H10W 72/90 (2026.01); H10W 72/952 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract
Semiconductor packages are provided. In one example, a semiconductor package includes a submount. The semiconductor package further includes a semiconductor die on the submount. The submount defines a base plane, and the submount includes at least one stud protrusion extending from the base plane in a direction toward the semiconductor die.
Dadvand, Afshin. (2026). Submounts with stud protrusions for semiconductor packages (U.S. Patent No. 12751305). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751305
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile