The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 15, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hye Jin Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate including a first wiring pattern, a redistribution layer disposed on an upper surface of the substrate, a solder resist layer disposed on an upper surface of the redistribution layer and including a second recess formed inside the solder resist layer, a first conductive terminal disposed on sidewalls and a bottom surface of the second recess, a first solder ball disposed on the first conductive terminal, and a semiconductor chip disposed on the solder resist layer and electrically directly connected to the redistribution layer through the first solder ball. The redistribution layer includes a first wiring pad, a first recess formed on an upper surface of the first wiring pad, a first metal seed layer disposed on sidewalls and a bottom surface of the first recess, and a first wiring post at least partially disposed on the first metal seed layer inside the first recess.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile