The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Mar. 25, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Minjin Kim, Suwon-si, KR;
Seongho Shin, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
The present disclosure relates to semiconductor packages. An example semiconductor package comprises a package substrate that includes a signal pad and a ground pad, an interposer substrate on the package substrate, a semiconductor chip on the interposer substrate, a plurality of signal lines on a top surface of the package substrate, and a first connection terminal between the package substrate and the interposer substrate. Each signal line of the plurality of signal lines extends in a first direction. The plurality of signal lines and the signal pad are spaced apart in a second direction that intersects the first direction. The plurality of signal lines, the signal pad, and the ground pad are in contact with the top surface of the package substrate. The first connection terminal overlaps at least a portion of the plurality of signal lines in a plan view.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile