The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Sep. 28, 2023
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Stefan Schwab, Singapore, SG;

Julian Treu, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 72/00 (2026.01); H10W 72/50 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/429 (2026.01); H10W 90/00 (2026.01); H10W 90/811 (2026.01); H10W 72/07553 (2026.01); H10W 72/07554 (2026.01); H10W 72/537 (2026.01); H10W 72/5445 (2026.01); H10W 72/547 (2026.01); H10W 72/5473 (2026.01); H10W 72/5475 (2026.01); H10W 90/753 (2026.01); H10W 90/756 (2026.01);
Abstract

A semiconductor device comprises a leadframe comprising a die pad and a plurality of leads, a semiconductor die disposed on the die pad, the semiconductor die including a contact pad on a first main face thereof, and one or more bond wires connected with the contact pad, wherein a lead of the plurality of leads is bent back and connected with at least one first bond wire of the one or more bond wires.


Find Patent Forward Citations

Schwab, Stefan. (2026). Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices (U.S. Patent No. 12751297). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751297

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…