The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Aug. 08, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Junhyung Kim, Seoul, KR;
Jong-Min Lee, Hwaseong-si, KR;
Minjung Choi, Suwon-si, KR;
Jimin Choi, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Semiconductor chips, semiconductor packages, and semiconductor chip fabrication methods may be provided. The semiconductor chip includes a substrate including a device region and an edge region, a device layer and a wiring layer sequentially stacked on the substrate, a sub-pad on the device region and a residual test pattern on the edge region wherein a sidewall of the residual test pattern is aligned with a sidewall of the substrate, and an upper dielectric stack covering the sub-pad and the residual test pattern. The upper dielectric stack may expose a portion of a top surface of the residual test pattern. A sidewall of the upper dielectric stack may have a stepped region.