The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Mar. 13, 2024
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

James P Mazza, Saratoga Springs, NY (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Reinaldo Vega, Mahopac, NY (US);

David Wolpert, Poughkeepsie, NY (US);

Takashi Ando, Eastchester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/43 (2026.01); H10W 20/00 (2026.01); H10W 20/41 (2026.01);
U.S. Cl.
CPC ...
H10W 20/432 (2026.01); H10W 20/081 (2026.01); H10W 20/435 (2026.01); H10W 20/063 (2026.01);
Abstract

A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a first metal line, a second metal line, and a third metal line running along a first orientation within a metal level, where the second metal line is located between the first and third metal lines. The semiconductor interconnect structure further includes a metal line connector running along a second orientation within the metal level. The metal line connector is located below the second metal line, and connected to the first and third metal lines.


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