The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Nov. 15, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Myungho Kong, Hwaseong-si, KR;

Sukhoon Kim, Hwaseong-si, KR;

Hoon Cho, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 43/27 (2023.01); H10B 43/40 (2023.01); H10W 20/20 (2026.01); H10W 20/41 (2026.01); H10W 20/44 (2026.01);
U.S. Cl.
CPC ...
H10W 20/20 (2026.01); H10B 43/27 (2023.02); H10B 43/40 (2023.02); H10W 20/425 (2026.01); H10W 20/4403 (2026.01);
Abstract

A vertical semiconductor device includes insulation patterns, channel structures, a first metal pattern structure and a second metal pattern. The insulation patterns are spaced apart from each other in a vertical direction. Each insulation pattern extends in a first direction parallel to the upper surface of a substrate. The channel structures pass through the insulation patterns. The first metal pattern structure include at least one first metal material, and extend in the first direction. The first metal pattern structure are positioned in a gap between adjacent insulation patterns in the vertical direction, and the first metal pattern structure is at a central portion of the gap. The second metal pattern includes a metal material that is different from the at least one first metal material, the second metal pattern may be on opposite sidewalls of the first metal pattern structure to fill a remainder portion of the gap.


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