The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Jul. 28, 2022
Applicant:

Genesse Valley Innovations, Llc, Santa Clara, CA (US);

Inventors:

Christopher L. Chua, San Jose, CA (US);

Ching-Fuh Lin, Palo Alto, CA (US);

Zhihong Yang, Palo Alto, CA (US);

Assignee:

Genesee Valley Innovations, LLC, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H10P 72/30 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7602 (2026.01); H10P 72/3402 (2026.01); H10P 72/3412 (2026.01);
Abstract

A transfer system includes first and second optical energy sources operable to provide a respective first and second optical energy at respective first and second wavelengths. A chiplet has a bonding feature configured to interface with a corresponding bonding feature of a target substrate. At least one of the bonding features absorb at the first wavelength such that applying the first optical energy bonds the chiplet to the target substrate or removes a bond between the chiplet and the target substrate. The system includes a transfer layer formed of a thermally switchable material that undergoes a phase change when heated. An optical absorber absorbs at the second wavelength such that applying the second optical energy heats a region of the transfer layer at a location of the chiplet when removing the chiplets from a source substrate during the transfer operation.


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