3d synapse device stack, 3d stackable synapse array using the 3d synapse device stacks and method of fabricating the stack

Abstract

Provided is a 3D synapse device stack, a 3D stackable synapse array using the same, and a method for manufacturing the 3D synapse device stack. The 3D synapse device stack comprises: a channel hole provided along a vertical direction on a substrate; a semiconductor body formed by applying a semiconductor material to the surface of the channel hole; first insulating layers and sources alternately stacked on a first side surface of an outer circumferential surface of the semiconductor body; first insulating layers and drains alternately stacked on a second side surface of an outer circumferential surface of the semiconductor body; a source line electrode connected to and in contact with a plurality of sources; a drain line electrode connected to and in contact with the plurality of drains; a plurality of word lines alternately stacked with first insulating layers on a third side surface of an outer circumferential surface of the semiconductor body; and a plurality of insulator stacks positioned between the word lines and the semiconductor body, wherein the semiconductor body, the source, the drain, the insulator stack, and the word line positioned on the same layer on the surface of the channel hole constitute a synapse device or a part thereof. The synapse device stack may implement an AND-type or NOR-type synapse array.