The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Apr. 04, 2023
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Jung Min Kwon, Gyeonggi-do, KR;
Seung Hwan Kim, Gyeonggi-do, KR;
Assignee:
SK hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/05 (2023.02); H10B 12/02 (2023.02); H10B 12/482 (2023.02);
Abstract
A method for fabricating a semiconductor device includes forming a stack body over a substrate; forming a sacrificial vertical structure including a double spacer in a first region of the stack body; forming a separation slit including a single spacer in a second region of the stack body to be spaced apart from the sacrificial vertical structure; forming a vertical opening in the first region of the stack body by removing the sacrificial vertical structure; and forming a vertical conductive line filling the vertical opening.