The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 24, 2024
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Atsushi Sakurai, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Abstract
An electronic component that includes: a substrate; a first electrode layer on the substrate and including conductive fillers and a binder; an insulation layer on the first electrode layer, the insulation layer having a via hole that penetrates the insulation layer in a lamination direction of the substrate, the first electrode layer, and the insulation layer; a second electrode layer on the insulation layer; and a via conductor in the via hole, the via conductor electrically coupling the first electrode layer and the second electrode layer, wherein a portion of the first electrode layer overlapping with the via hole in a top view includes a coupling layer coupled to the via conductor, the coupling layer having a content rate of the binder lower than a content rate of the binder in a portion of the first electrode layer positioned outside the via hole in the top view.