The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

May. 22, 2024
Applicant:

Tianjin University, Tianjin, CN;

Inventors:

Kaixue MA, Tianjin, CN;

Yi Wu, Tianjin, CN;

Ming Yin, Tianjin, CN;

Assignee:

Tianjin University, Tianjin, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 1/202 (2006.01); H01P 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01P 1/202 (2013.01); H01P 3/12 (2013.01);
Abstract

A metal-integrated suspended line includes multiple metal substrates stacked from top to bottom and connected by rivets or screws to form a self-encapsulating structure. At least two of the metal substrates except a top metal substrate and a bottom metal substrate are spaced apart from each other, and each of the at least two metal substrates defines an air-filled hollow cavity. One of the metals substrates disposed between hollow cavities of the two metal substrates is provided with a circuit structure. The metal-integrated suspended line can give full play to advantages of all-metal-integrated suspended line platform, and achieve the circuit structure with high Q value, good electromagnetic shielding and excellent heat dissipation performance; meanwhile, a slotline structure can be designed by etching slots on the metal substrate disposed between the two hollow cavities of two of the at least two metal substrates.


Find Patent Forward Citations

MA, Kaixue. (2026). Metal integrated suspended line (misl) circuits (U.S. Patent No. 12750947). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12750947

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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