The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Dec. 01, 2023
Kmw Inc., Hwaseong-si, KR;
Bae Mook Jeong, Suwon-si, KR;
Kyo Sung Ji, Hwaseong-si, KR;
Seong Min Ahn, Namyangju-si, KR;
Chi Back Ryu, Hwaseong-si, KR;
Jae Eun Kim, Suwon-si, KR;
Seung Min Lee, Suwon-si, KR;
Ki Hun Park, Hwaseong-si, KR;
Won Jun Park, Yongin-si, KR;
Jun Woo Yang, Hwaseong-si, KR;
KMW INC., Hwaseong-si, KR;
Abstract
The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.