The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Oct. 10, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Soonho Hwang, Suwon-si, KR;

Himchan Yun, Suwon-si, KR;

Kookjoo Lee, Suwon-si, KR;

Hojung Nam, Suwon-si, KR;

Sungkoo Park, Suwon-si, KR;

Kyungjae Lee, Suwon-si, KR;

Donguk Choi, Suwon-si, KR;

Seunghwan Kim, Suwon-si, KR;

Jaebong Chun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H01Q 1/24 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H04M 1/0214 (2013.01); H01Q 1/243 (2013.01); H04M 1/0268 (2013.01);
Abstract

A foldable electronic device is provided that includes a hinge module, a first housing coupled to a first side of the hinge module, a first printed circuit board disposed inside the first housing and including a first wireless communication module, a processor, and a first ground or a second ground, and a second housing coupled to a second side of the hinge module, in which the first housing includes a first segmenting portion, a second segmenting portion, a first conductive portion, and a second conductive portion, in which the second housing includes a second wireless communication module, a third segmenting portion, a fourth segmenting portion, a third conductive portion, and a fourth conductive portion, and in which a matching circuit is disposed between the first conductive portion and the first ground, and a first filter circuit is connected to a signal path between the first conductive portion and the matching circuit.


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