The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

May. 17, 2024
Applicant:

Harman International Industries, Incorporated, Stamford, CT (US);

Inventors:

Xuelin Liu, Kunshan City, CN;

Huijing Yao, Shanghai, CN;

Hao Xu, Shanghai, CN;

Hao Liu, Fremont, CA (US);

Havent Chen, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/02 (2006.01); H01Q 1/32 (2006.01); H01Q 1/44 (2006.01); H01Q 21/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01Q 1/3233 (2013.01); H01Q 1/3275 (2013.01); H01Q 1/44 (2013.01); H01Q 21/28 (2013.01);
Abstract

Systems are disclosed herein for a conformal antenna assembly including an antenna heatsink for maintaining a temperature of one or more components of the antenna assembly below a threshold temperature. The antenna assembly includes a printed circuit board (PCB) assembly including a PCB and one or more electrical components mounted thereon, a network access device (NAD) module soldered to the PCB, and an antenna heatsink including a first antenna integrally formed with a heatsink, wherein the antenna heatsink is coupled to a first side of the PCB via clips and coupled to the NAD module via a first thermal adhesive layer interposed therebetween.


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