The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jun. 18, 2024
Applied Materials, Inc., Santa Clara, CA (US);
Edward P. Hammond, IV, Hillsborough, CA (US);
David Coumou, Santa Clara, CA (US);
Upendra Ummethala, Santa Clara, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
The present disclosure describes a semiconductor wafer processing system that uses a splitter circuit to delivery RF power from a power supply to multiple process chambers. The wafer processing system includes a first process chamber, a second process chamber, a power supply, a match circuit, and a splitter circuit. The power supply produces an electric current. The match circuit receives the electric current from the power supply and presents an impedance to the power supply. The splitting circuit includes a first leg and a second leg. The first leg includes a first capacitor that directs a first portion of the electric current from the match circuit to the first process chamber. The second leg includes a second capacitor that directs a second portion of the electric current from the match circuit to the second process chamber.