The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Oct. 30, 2024
Applicant:
Yazaki Corporation, Tokyo, JP;
Inventors:
Kosuke Tashiro, Shizuoka, JP;
Maki Yamada, Shizuoka, JP;
Assignee:
YAZAKI CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/02 (2006.01); H01B 3/30 (2006.01); H01B 13/14 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0275 (2013.01); H01B 3/307 (2013.01); H01B 7/0225 (2013.01); H01B 13/141 (2013.01); H01B 13/148 (2013.01);
Abstract
A foamed electric wire includes a conductor, and a covering layer that covers the conductor and is constituted by one or more layers. At least one layer of the covering layer is a foamed covering layer made of a resin composition containing a polypropylene resin, that is formed by foam extrusion molding. An average foam diameter of the foamed covering layer is 30 μm or less in a cross-sectional direction, and 60 μm or less in a longitudinal direction. A foaming ratio of the foamed covering layer is 25% or more and 55% or less. An arithmetic average height of a surface of the foamed electric wire is 20 μm or less.