The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Mar. 18, 2024
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Hideki Tomizawa, Kanagawa, JP;

Kazuhiro Hasegawa, Kanagawa, JP;

Takahiro Ohno, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 3/14 (2006.01); B32B 3/16 (2006.01); H01B 1/22 (2006.01); H01B 1/24 (2006.01); H01B 5/14 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); B32B 3/10 (2013.01); B32B 3/14 (2013.01); B32B 3/16 (2013.01); H01B 1/22 (2013.01); H01B 1/24 (2013.01);
Abstract

A conductive film having excellent adhesiveness of a conductive thin wire after a durability test film includes: a transparent substrate; and a mesh pattern that is disposed on the transparent substrate and is formed of a conductive thin wire, in which the conductive thin wire includes a black layer including carbon black, a palladium-containing layer, and a metal plating layer in order from the transparent substrate side.


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