The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2026
Filed:
Jul. 26, 2022
Osaka University, Osaka, JP;
OSAKA UNIVERSITY, Osaka, JP;
Abstract
Provided are: a solid-state joining method with which it is possible to control the discharge direction of burrs and to realize sufficient joining strength; a solid-state joined joint and a solid-state joined structure that are obtained through the solid-state joining method; and a solid-state joining device that can be suitably used in the solid-state joining method. A solid-state joining method characterized by having a first step for bringing end parts of one material being joined and another material being joined into butting contact with one another and forming a joining interface, a second step for increasing the temperature in the vicinity of the joining interface by using an external heating means, and a third step for plastically deforming the joining interface to thereby discharge burrs and form a solid-state joined interface, the plate thickness of the end part of the one material being joined and/or the other material being joined is reduced, and the solid-state joining method having a gradient such that the plate thickness decreases on a side where discharge of the burrs is suppressed.