The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Dec. 19, 2021
International Business Machines Corporation, Armonk, NY (US);
Katsuyuki Sakuma, Fishkill, NY (US);
Mukta Ghate Farooq, Hopewell Junction, NY (US);
Ramachandra Divakaruni, Ossining, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A packaged device that carries multiple component devices uses a back-mounted structure to reduce the area of the substrates in the package. The package includes a first organic laminate substrate and a second organic laminate substrate. The first organic laminate substrate is the base substrate of the packaged device. The second organic laminate substrate has higher wiring density than the first organic laminate substrate. The second organic laminate substrate is joined to a top surface (or module mounting side) of the first organic laminate substrate. A first component device is mounted on a top surface of the second organic laminate substrate. A second component device is mounted on a bottom surface of the second organic laminate substrate. The second component device recesses into a cavity at the top surface of the first organic laminate substrate.