The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
May. 11, 2021
Applicant:
Elta Systems Ltd., Lod, IL;
Inventors:
Itzhak Shapir, Haifa, IL;
Michael Kedem, Ashdod, IL;
Assignee:
ELTA SYSTEMS LTD., Lod, IL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2023.01); H10W 44/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/47 (2026.01); H10W 76/47 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 76/47 (2026.01); H10W 44/20 (2026.01); H10W 74/016 (2026.01); H10W 74/114 (2026.01); H10W 74/47 (2026.01); H10W 90/00 (2026.01); H10W 44/241 (2026.01);
Abstract
An integrated circuit (IC) assembly and a method for encapsulating of IC are presented. The IC assembly comprises an IC substrate having one or more micro-devices, at least one dielectric matrix element placed on said IC substrate over at least one of its one or more micro-devices; and an encapsulation element applied over said IC substrate and said at least one dielectric matrix element placed thereon to enclose and seal said IC substrate.