The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Apr. 04, 2023
Tdk Corporation, Tokyo, JP;
Shuichi Takizawa, Tokyo, JP;
Hiromu Harada, Tokyo, JP;
Atsushi Yoshino, Tokyo, JP;
Yuki Okino, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
An electronic circuit package disclosed in the present disclosure includes: a package board having an upper surface, a bottom surface positioned on a side opposite to the upper surface, and a side surface connecting the upper and bottom surfaces; an electronic component mounted on the upper surface of the package board; a first protective layer covering the upper surface of the package board so as to embed therein the electronic component; and a second protective layer covering the side surface of the package board. The first and second protective layers contact each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile