The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

May. 26, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Chanhoon Ko, Suwon-si, KR;

Chulmin Lee, Suwon-si, KR;

Inhwan Oh, Suwon-si, KR;

Kyounghee Lim, Suwon-si, KR;

Sohyun Bae, Suwon-si, KR;

Sanghoon Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01);
U.S. Cl.
CPC ...
H10W 72/90 (2026.01); H10W 72/019 (2026.01); H10W 72/01935 (2026.01); H10W 72/01951 (2026.01); H10W 72/9415 (2026.01);
Abstract

A substrate includes: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a via hole including a lower hole formed in the first insulating layer, and an upper hole formed in the second insulating layer and connected to the lower hole, in which a width of an upper side of the lower hole is larger than a width of a lower side of the lower hole, and a width of an upper side of the upper hole is larger than a width of a lower side of the upper hole.


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