The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Feb. 25, 2025
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Michael Christopher Lamarra, Harleysville, PA (US);
Manoj Kumar Venna, Singapore, SG;
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Abstract
A wire bonding array is provided. The wire bonding array includes a plurality of wire bonding systems, each of the plurality of wire bonding systems including a bond head assembly for bonding a wire to a workpiece and a support structure for supporting the workpiece. The wire bonding array also includes a wire bonding tool replacement system configured for installation on, and removal from, each of the plurality of wire bonding systems. The wire bonding array also includes a service robot configured to install the wire bonding tool replacement system on, and remove the wire bonding tool replacement system from, each of the plurality of wire bonding systems.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile