The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Sep. 08, 2023
Applicant:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Inventors:
Eric N. Anderson, Marion, IA (US);
Timothy R. Fannin, Urbana, IA (US);
Brent J Nelson, Marion, IA (US);
Matthew P. Corbett, Mount Vernon, IA (US);
Assignee:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/20 (2026.01); H05K 1/181 (2026.01); H10W 40/22 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H05K 1/181 (2013.01); H10W 40/22 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01); H05K 2201/0715 (2013.01); H05K 2201/0723 (2013.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 90/736 (2026.01); H10W 90/754 (2026.01);
Abstract
Neutron single effect events are mitigated using gadolinium. Layers of gadolinium are fully encapsulated as part of an airborne electronic hardware, in circuit boards, in heat sinks, and as part of the device packaging. The gadolinium layers are designed to shield semiconductor chips from neutrons. Shielding the semiconductor chips from the neutrons reduces the upset rate of device packages using the semiconductor ships.