The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Jun. 28, 2023
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Hiroaki Kageyama, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 74/20 (2026.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01); H10P 74/00 (2026.01);
U.S. Cl.
CPC ...
H10P 74/207 (2026.01); H10H 20/01 (2025.01); H10H 20/0364 (2025.01); H10H 20/857 (2025.01); H10H 29/142 (2025.01); H10P 74/232 (2026.01); H10P 74/238 (2026.01); H10P 74/273 (2026.01);
Abstract

A method of manufacturing a light emitting device comprises: providing a structure body including a substrate and a plurality of semiconductor parts arranged on the substrate, wherein the semiconductor parts individually includes a first semiconductor layer, a second semiconductor layer, a first terminal and a second terminal; disposing an insulating member that covers the semiconductor parts; forming wirings at locations above the semiconductor parts, wherein, the wirings each connect the first terminal and the second terminal of two adjacent semiconductor parts in a direction of arrangement, the wirings serially connect the semiconductor parts, and an area of individual of the wirings is larger than an area of the first terminal or an area of the second terminal in a top view; evaluating electrical properties of the semiconductor parts connected by the wirings by bringing a testing device into contact with the wiring; and removing the insulating member and the wirings.


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