The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

May. 27, 2021
Applicant:

Sharp Kabushiki Kaisha, Sakai City, JP;

Inventors:

Sentaro Kida, Sakai City, JP;

Jun Sakuma, Sakai City, JP;

Yasushi Asaoka, Sakai City, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai City, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/122 (2023.01); H10K 50/115 (2023.01); H10K 50/13 (2023.01); H10K 59/12 (2023.01); H10K 59/131 (2023.01); H10K 71/20 (2023.01);
U.S. Cl.
CPC ...
H10K 59/122 (2023.02); H10K 50/115 (2023.02); H10K 50/13 (2023.02); H10K 59/1201 (2023.02); H10K 59/131 (2023.02); H10K 71/221 (2023.02);
Abstract

A method for manufacturing a display device includes the following: a) forming a first resist layer over a substrate; b) patterning the first resist layer by removing the first resist layer formed over a first region of the substrate; c) forming a first light-emitting material layer over the first resist layer patterned, and above the first region of the substrate with the first resist layer removed; d) forming a second resist layer over the first light-emitting material layer; e) patterning the second resist layer by removing the first resist layer formed over a second region of the substrate, followed by lifting off the first light-emitting material layer and the second resist layer formed over the first resist layer over the second region; and f) forming a second light-emitting material layer over the second resist layer patterned, and above the second region of the substrate with the first resist layer removed.


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