The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

May. 30, 2022
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Shuang Sun, Beijing, CN;

Fangzhen Zhang, Beijing, CN;

Xinxing Wang, Beijing, CN;

Jing Niu, Beijing, CN;

Tingting Zhou, Beijing, CN;

Wei Wang, Beijing, CN;

Yanan Niu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 29/142 (2025.01); H10W 90/00 (2026.01);
Abstract

The present application provides a light emitting chip, a manufacturing method for the same, and a light emitting device, relating to the field of display technology. The light emitting chip includes a substrate and a plurality of light emitting units arranged in an array on the substrate. The light emitting unit includes at least one first electrode disposed on the substrate and a plurality of epitaxial wafers arranged in an array, at least two of the epitaxial wafers have different colors. Several epitaxial wafers in the epitaxial wafers share one of the first electrodes.


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