The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Jun. 14, 2023
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Hiroaki Kageyama, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/852 (2025.01);
U.S. Cl.
CPC ...
H10H 20/8514 (2025.01); H10H 20/01 (2025.01); H10H 20/852 (2025.01); H10H 20/0361 (2025.01); H10H 20/0362 (2025.01);
Abstract

A method for manufacturing a light-emitting device includes: providing a substrate on which a semiconductor portion is disposed; providing a support substrate having conductivity, including a first surface and a second surface on a side opposite to the first surface, and including a groove portion formed at the first surface; electrically connecting the semiconductor portion and the support substrate by disposing the semiconductor portion on the first surface across the groove portion in a plan view; removing the substrate from the semiconductor portion; bonding a wavelength conversion member to the semiconductor portion from which the substrate has been removed; supplying a resin member having light reflectivity into the groove portion and a space between the support substrate and the wavelength conversion member; and exposing the resin member in the groove portion from the support substrate by removing part of the support substrate from the second surface side.


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