The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Oct. 30, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Korekiyo Ito, Nagaokakyo, JP;

Masatomi Harada, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/00 (2025.01); H01G 4/33 (2006.01); H03H 7/01 (2006.01); H03H 7/38 (2006.01); H03H 9/02 (2006.01); H03H 9/17 (2006.01); H03H 9/25 (2006.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10D 86/201 (2025.01); H01G 4/33 (2013.01); H03H 7/0115 (2013.01); H03H 7/38 (2013.01); H03H 9/02125 (2013.01); H03H 9/02952 (2013.01); H03H 9/173 (2013.01); H03H 9/25 (2013.01); H10D 1/68 (2025.01);
Abstract

A support substrate for a passive electronic component, the support substrate including: a semiconductor substrate; a charge trap layer on the semiconductor substrate and having a higher crystal defect density than the semiconductor substrate; and an insulating layer on the charge trap layer. In a first aspect, the insulating layer is composed of silicon nitride, and an atomic concentration ratio of N to a total amount of Si and N in the insulating layer is not greater than 45 atom %. In a second aspect, the insulating layer includes a first insulating layer on the charge trap layer; and a second insulating layer on the first insulating layer, wherein a first fixed charge within the first insulating layer and a second fixed charge within the second insulating layer have opposite polarities, and the first insulating layer has a thickness of not less than 0.5 nm and not greater than 3 nm.


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