The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Jan. 25, 2023
Applicant:
Borgwarner Us Technologies Llc, Wilmington, DE (US);
Inventor:
Edward Choi, Lake Orion, MI (US);
Assignee:
BorgWarner US Technologies LLC, Wilmington, DE (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 1/00 (2006.01); H02M 1/32 (2007.01); H10W 40/00 (2026.01); H10W 40/22 (2026.01); H10W 40/60 (2026.01); H10W 40/77 (2026.01); H10W 70/40 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01); B60L 3/00 (2019.01); B60L 50/51 (2019.01); B60L 53/20 (2019.01); B60L 53/22 (2019.01); B60R 16/02 (2006.01); H02M 1/08 (2006.01); H02M 1/42 (2007.01); H02M 1/44 (2007.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H02M 7/5387 (2007.01); H05K 1/14 (2006.01); H05K 1/181 (2026.01); H05K 1/182 (2026.01); H05K 5/02 (2006.01); H10D 64/01 (2025.01); H10W 40/20 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); H02M 1/0054 (2021.05); H02M 1/327 (2021.05); H05K 7/20154 (2013.01); H05K 7/20854 (2013.01); H05K 7/209 (2013.01); H10W 40/037 (2026.01); H10W 40/22 (2026.01); H10W 40/611 (2026.01); H10W 40/641 (2026.01); H10W 40/778 (2026.01); H10W 70/481 (2026.01); H10W 70/65 (2026.01); H10W 90/00 (2026.01); B60L 3/003 (2013.01); B60L 50/51 (2019.02); B60L 53/20 (2019.02); B60L 53/22 (2019.02); B60R 16/02 (2013.01); H02M 1/0009 (2021.05); H02M 1/08 (2013.01); H02M 1/32 (2013.01); H02M 1/322 (2021.05); H02M 1/4258 (2013.01); H02M 1/44 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H02M 7/5387 (2013.01); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 5/0247 (2013.01); H05K 7/2039 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10166 (2013.01); H10D 64/018 (2025.01); H10W 40/226 (2026.01); H10W 40/235 (2026.01); H10W 40/60 (2026.01); H10W 72/07331 (2026.01);
Abstract
A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking feature on a surface of the at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.
Choi, Edward. (2026). Systems and methods for an interlocking feature on a power module (U.S. Patent No. 12745368). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12745368
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile