The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Oct. 28, 2021
Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;
Agneta Ljungbro, Bjärred, SE;
Emil Nylander, Lund, SE;
Per Ingelhag, Alingsås, SE;
Tony Josefsson, Sandhult, SE;
Torbjörn Dahl, Västra Frölunda, SE;
Peter Melin, Lindome, SE;
Telefonaktiebolaget LM Ericsson (publ), Stockholm, SE;
Abstract
The present invention relates to a carrier substrate comprising thermal vias for thermally interconnecting components arranged on at least a first side of the carrier substrate to a heat pipe, wherein the carrier substrate further comprises a first substrate with thermal vias configured to be connected to a first component; a second substrate comprising a groove with a heat pipe; and wherein the first substrate is adhered to the second substrate by an adhesive, such that the heat pipe is embedded in said groove between the first substrate and the second substrate. The present invention also relates to an electronic assembly comprising such a carrier substrate.