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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12745045 B1

PDFFull Text
Date of Patent:
Sep. 22, 2026

Filed:

Sep. 04, 2024

Microphone device based on two-dimensional piezoelectric material layer having protective layer formed thereon, and method for fabricating the same

Applicants:

Uif (University Industry Foundation), Yonsei University, Seoul, KR;

Research & Business Foundation Sungkyunkwan University, Suwon-si, KR;

Inventors:

Sang Woo Kim, Seoul, KR;

So Hee Kim, Seoul, KR;

Young Jun Kim, Suwon-si, KR;

Hyeon Yeong Lee, Seoul, KR;

Fengyi Pang, Seoul, KR;

Assignees:

UIF (University Industry Foundation), Yonsei University, Seoul, KR;

RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Suhan Ni

Int. Cl.
CPC ...
H04R 17/02 (2006.01); H04R 31/00 (2006.01); H10N 30/00 (2023.01); H10N 30/076 (2023.01); H10N 30/079 (2023.01); H10N 30/853 (2023.01);
U.S. Cl.
CPC ...
H04R 17/02 (2013.01); H04R 31/003 (2013.01); H10N 30/076 (2023.02); H10N 30/079 (2023.02); H10N 30/708 (2024.05); H10N 30/853 (2023.02);
Abstract

An excellent ultra-small microphone device with improved mechanical properties due to a protective layer formed on an upper and/or lower surface of a two-dimensional material having piezoelectric properties is provided to replace a conventional MEMS (Micro-Electro Mechanical Systems) microphone device. In the microphone device, the protective layer of a thickness of several hundred nm is formed on the upper and/or lower surface of the two-dimensional TMD material to protect the piezoelectric material layer during a back etching process and to contribute to the mechanical stability of the device.

Find Patent Forward Citations

Kim, Sang. (2026). Microphone device based on two-dimensional piezoelectric material layer having protective layer formed thereon, and method for fabricating the same (U.S. Patent No. 12745045). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12745045

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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