The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Sep. 09, 2022
Applicant:

Ningbo Sunny Opotech Co., Ltd., Ningbo City, CN;

Inventors:

Haijiang Zhu, Ningbo City, CN;

Yihang Lao, Ningbo City, CN;

Yafei Zhu, Ningbo City, CN;

Junlong Nie, Ningbo City, CN;

Yongming Chen, Ningbo City, CN;

Wei Li, Ningbo City, CN;

Dike Fan, Ningbo City, CN;

Hangang Wei, Ningbo City, CN;

Yi Yang, Ningbo City, CN;

Sisi Yu, Ningbo City, CN;

Chunmei Liu, Ningbo City, CN;

Kaikai Zhao, Ningbo City, CN;

Yurong Wu, Ningbo City, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/14 (2006.01); H05K 3/328 (2026.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/147 (2013.01); H05K 3/328 (2013.01); H05K 2201/095 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/2009 (2013.01);
Abstract

Disclosed is a circuit board for a camera module including a circuit board body and at least two lateral connecting belts, wherein the lateral connecting belts are led out from the side surfaces of the circuit board body and bend upwards, and, after being bent, extend on the side surfaces of a camera module to form lateral connecting belt bodies, an outer surface of a hard plate of one of the lateral connecting belts is provided with a plurality of bonding pads, and the hard plate of the other lateral connecting belt has a plurality of conductive holes, so that the movement resistance of a circuit board body and a photosensitive chip can be reduced, while the yield and production efficiency are improved.


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