The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Jun. 21, 2024
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Tejinder Singh, Manotick, CA;

Navjot Kaur Khaira, Manotick, CA;

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 5/18 (2006.01); G06F 30/392 (2020.01); H01P 5/02 (2006.01); G06F 119/06 (2020.01);
U.S. Cl.
CPC ...
H01P 5/184 (2013.01); G06F 30/392 (2020.01); H01P 5/028 (2013.01); G06F 2119/06 (2020.01);
Abstract

The technology described herein is directed towards a wide-bandwidth, high-frequency (e.g., millimeter wave) crossover coupler. One implementation of the crossover coupler is designed with a single top metallization layer, is passive, and does not require any interconnecting layer. The design can include cross-shaped apertures enclosed by four metallic inner and outer partial patches, which effectively direct the electromagnetic fields to the crossover circuit's ports. Straightforward design tweaks can change the radio frequency (RF) characteristics of the crossover coupler, including, for example, selecting various design dimensions that determine the center frequency, bandwidth, coupling strength, and/or characteristic impedance of the crossover coupler, and can account for substrate permittivity and the height of the substrate. A cutout in a ground plane beneath the substrate can be sized to mitigate RF mismatch.


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