The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Oct. 16, 2024
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jung Wun Hwang, Suwon-si, KR;

Chae Dong Lee, Suwon-si, KR;

Sun Kyoung Park, Suwon-si, KR;

Ji Hye Oh, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/005 (2013.01); H01G 4/1227 (2013.01); H01G 4/224 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component includes a body including a dielectric layer and first to fourth internal electrode layers disposed alternately in a first direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces respectively, wherein the internal electrode layer includes an internal electrode and a dummy electrode spaced apart from each other with a spacing portion therebetween, and at least two of the spacing portions may include regions overlapping each other in the first direction and other regions do not overlapping each other.


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