Module kit for a chemical and/or electrolytic surface treatment of a substrate

Abstract

The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substrates and a use of such a module kit. The module kit comprises a process chamber, a first exchangeable dispense unit for dispensing a first liquid on the substrate, and a second exchangeable dispense unit for dispensing a second liquid on the substrate. The process chamber is dimensioned to receive either the first exchangeable dispense unit or the second exchangeable dispense unit. The first exchangeable dispense unit and the second exchangeable dispense unit are each dimensioned to receive the substrate. The process chamber comprises a kit interface for supplying the first liquid or the second liquid. The first exchangeable dispense unit comprises a first inlet interface for the first liquid. The second exchangeable dispense unit comprises a second inlet interface for the second liquid. The kit interface, the first inlet interface and the second inlet interface are configured for an exchangeable cooperation either between the kit interface and the first inlet interface or between the kit interface and the second inlet interface.